Flatness and hole accuracy are ensured through stable machining and precise measurement control. A BT50 spindle and rigid cross-slide guideways keep milling stable, while high-precision linear encoders control material removal in closed loop. Laser displacement sensors check the machined surface, and a CNC servo feed system adjusts the machining position and bevel/tilt angles within ±3°. A 25° inclined table with automatic chip removal prevents chip interference during machining.